Microwave popcorn package with adhesive pattern
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United States of America Patent
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Jul 27, 1999
Issued Date -
N/A
app pub date -
Sep 11, 1997
filing date -
Jan 16, 1996
priority date (Note) -
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Abstract
A microwave popcorn package is provided. The package generally comprises plies of flexible material, such as paper, bonded or adhered to one another, with a microwave interactive construction therebetween. The laminating adhesive between the plies is applied in a preferred pattern, to advantage.
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