Plasma treatment method and plasma treatment system
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United States of America Patent
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Jul 27, 1999
Grant Date -
N/A
app pub date -
Sep 2, 1997
filing date -
Sep 3, 1996
priority date (Note) -
Expired
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Abstract
A reactive gas supplied to a chamber 1 is put into plasma by supplying radio frequency power to the chamber 1 intermittently or while repeating high and low levels alternately and a specimen A in the chamber 1 is treated by the plasma. A positive pulse-like bias voltage synchronized with a period in which the radio frequency power is not supplied or a period in which low-level power is supplied is applied to the specimen A for preventing charging.
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