Epoxy and epoxy-polyacrylate dispersions containing reactive diluent processes for their production and their use
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United States of America Patent
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Jul 20, 1999
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N/A
app pub date -
Sep 25, 1996
filing date -
Sep 29, 1995
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Expired
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Abstract
Aqueous, low-solvent coating compositions comprising a base resin dispersion comprising of an epoxy resin, prepared by condensation of one or more epoxide compounds having at least two epoxide groups per molecule and an aromatic polyol; a dispersant comprising a condensation product of an aliphatic polyol having a weight-average molar mass (M.sub.w) of from 200 to 20,000 g/mol and an epoxide compound having at least two epoxide groups per molecule, and low molar mass, liquid, epoxy-functional compounds as diluents, and also water; an aqueous curing agent for the modified epoxy resin (I), which is suitable for curing at room temperature or at elevated temperatures (forced drying), components (I) and (II) being employed in mass fractions such that the ratio of the number of reactive epoxide groups in (I) to the number of amine hydrogen atoms in (II) is between 1:0.75 and 1:2. The coating compositions exhibit an extended pot life. They can be used to produce coatings and in water-soluble adhesives.
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