Method of making mandrels and circuits therefrom
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United States of America Patent
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Jul 20, 1999
Grant Date -
N/A
app pub date -
Feb 10, 1997
filing date -
Feb 10, 1997
priority date (Note) -
Expired
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Abstract
The present invention generally includes a process in which a mandrel for semi-additive construction of circuitry is fabricated by laminating shim stock or foil of stainless steel onto a suitable deformable substrate such as a polyimide glass board. Dimples for making raised features on circuitry are formed in the mandrel with a tool. The use of shim stock makes the mandrel relatively light and suitable for automated processing similar to that used to construct circuits on circuit boards.
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