Ceramic-filled fluoropolymer composite containing polymeric powder for high frequency circuit substrates
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United States of America Patent
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Jul 13, 1999
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N/A
app pub date -
Feb 6, 1997
filing date -
Feb 6, 1997
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Expired
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Abstract
A ceramic-filled fluoropolymer composite is presented, suitable for use as an electrical substrate material. In accordance with the present invention, a ceramic-filled fluoropolymer composite further comprises high temperature, high modulus, finely powdered polymeric material. The median particle size of the finely powdered polymeric material is less than about 200 .mu.m. The finely powdered polymeric material is further stable at temperatures greater than about 350.degree. C. Substitution of the finely powdered polymeric material for fluoropolymer matrix material within a fairly narrow concentration range results in a composite with enhanced flexural modulus, but no deleterious effect on dielectric loss. The composite material is plated or clad with conductive material.
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