High-power diode laser and method for mounting the same
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United States of America Patent
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Jul 6, 1999
Grant Date -
N/A
app pub date -
Oct 23, 1997
filing date -
Oct 29, 1996
priority date (Note) -
Expired
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Abstract
A high-power diode laser and a method for mounting same are described. Predetermined breaking locations in the laser bar are provided which, during cooling after the laser bar has been soldered to a heat sink having a smaller thermal expansion coefficient, lead to breakage at defined locations between the single laser diodes of the laser bar. As a result of the physical division of the laser bar, it is possible to use a solder which has low ductility (hard solder) at room temperature, since destruction of the single laser diodes of the laser bar as a result of mechanical stresses can be ruled out.
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