Gap filling method using high pressure

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United States of America Patent

PATENT NO 5918152
SERIAL NO

08933368

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Abstract

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A method is described for filling narrow gaps in a surface that is being overcoated. This has been achieved by heating the overcoating layer to a sufficient extent so that it flows relatively easily. This, in combination with externally applied pressure, causes the overcoating layer to effectively fill any narrow gaps in the surface being coated. Temperature and pressure are applied for a time that is sufficient to allow small quantities of gas that may have become trapped in the gaps to bubble to the surface. In an alternative embodiment, the surface to be coated is subjected to negative pressure prior to application of the coating. This eliminates the possibility of trapping gas in the gaps so a waiting time is no longer necessary.

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Patent Owner(s)

Patent OwnerAddress
CHARTERED SEMICONDUCTOR MANUFACTURING PTE LTD60 WOODLANDS INDUSTRIAL PARK D STREET 2 SINGAPORE 738406

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Erzhuang, Liu Singapore, SG 1 9
Lin, Charles Singapore, SG 49 453
Lin, Yih-Shung Singapore, SG 40 626

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