Compact microwave module
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United States of America Patent
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Jun 29, 1999
Grant Date -
N/A
app pub date -
Apr 3, 1997
filing date -
Apr 4, 1996
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The invention provides a microwave module including a plurality of stacked elementary structures forming a unit, each elementary structure comprising a bottom dielectric layer on a top surface of which an integrated circuit (20, 21) is disposed, and a top dielectric layer covering the circuit (20, 21). The module is characterized by a connection line (20a, 30, 21a) between two respective circuits belonging to first and second elementary structures, the connection line being constituted by an input coplanar line (21a) disposed on the top surface of the bottom dielectric layer of the first structure, by an output coplanar line (20a) disposed on the top surface of the bottom dielectric layer of the second structure, and a by link coplanar line (30) connecting one end of the input coplanar line to one end of the output coplanar line.
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