Method and structure to interconnect traces of two conductive layers in a printed circuit board
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United States of America Patent
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May 25, 1999
Grant Date -
N/A
app pub date -
Oct 4, 1995
filing date -
Oct 4, 1995
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A micro filled material includes a binding material and optionally includes a number of particles. The binding material and the particles can be formed of any conductive or nonconductive material. Using such a micro filled via material, an electrical conductor is formed in a substrate for supporting one or more electronic components using the following steps: placing the micro filled via material between two conductive layers at various locations in a substrate at which an electrical conductor is to be formed; and optionally programming the micro filled via material to reduce the resistance of, or to form an electrical conductor.
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