Method of forming assemblies of circuit boards in different planes
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United States of America Patent
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-
May 11, 1999
Grant Date -
N/A
app pub date -
Jan 30, 1998
filing date -
Jan 30, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of forming a circuit board with electronic assemblies lying in different planes, includes providing a single circuit board with entire electronic assemblies pressed thereon. A channel is then formed in the circuit board of a predetermined depth to divide the circuit board into two separate, but integral portions. The circuit board is then bent at a point between the first and second portions of the circuit board such that the second portion of the circuit board can be bent between 0 and 180 degrees with respect to the first portion of the circuit board.
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