Inspection method and device of wafer surface
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United States of America Patent
Stats
-
May 11, 1999
Grant Date -
N/A
app pub date -
Apr 8, 1996
filing date -
Apr 10, 1995
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A wafer surface inspection method and device including a low angle light receiving system having an elevation angle less than 30.degree. with reference to the wafer surface, and a high angle light receiving system having an elevation angle equal to or larger than 30.degree., scans the wafer with a laser beam, receives scattered light to perform extraneous substance detection in response to the scanning, and detects wafer defects only by the high angle light receiving system, and sticking extraneous substances by either the low angle receiving system or by both the low angle light receiving system and the high angle light receiving system.
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Cited Art Landscape
Patent Citation Ranking
- 133 Citation Count
- G01N Class
- 98.85 % this patent is cited more than
- 26 Age