Structure for semiconductor package for improving the efficiency of spreading heat
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United States of America Patent
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May 11, 1999
Grant Date -
N/A
app pub date -
May 12, 1998
filing date -
May 12, 1998
priority date (Note) -
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Abstract
The present invention includes a substrate having a first opening. A heat spreader is attached on the bottom surface of the substrate. The bottom side surface of the heat spreader has trench pattern. The trench pattern includes a plurality of connecting cavities and a plurality of trenches. The chip is mounted on the top side surface of the heat spreader. A supporting member is formed on the top side surface of the substrate. The space among the substrate, the chip, the heat spreader and the supporting member is encapsulated by encapsulating material. The preformed solder balls are mounted on the bottom side surface of the substrate.
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