Closed loop liquid cooling for semiconductor RF amplifier modules
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United States of America Patent
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May 4, 1999
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N/A
app pub date -
Jun 18, 1997
filing date -
Jun 18, 1997
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Abstract
A closed loop liquid cooling system for an RF transistor module including a plurality of elongated microchannels connected between a pair of coolant manifolds for conducting liquid coolant beneath one or more transistor dies to dissipate the heat generated thereby, a heat exchanger, a miniature circulating pump located on the module, and passive check valves having tapered passages for controlling the flow of coolant in the loop. The valves are truncated tapered passage microchannel valves having no moving parts and are fabricated so as to be a part of either the circulating pump, the coolant manifolds, or the microchannels.
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