Low-temperature fusing brazing material, and wiring board and semiconductor device-housing package assembled with the same
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United States of America Patent
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May 4, 1999
Grant Date -
N/A
app pub date -
Aug 26, 1996
filing date -
Aug 25, 1995
priority date (Note) -
Expired
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Abstract
A low-temperature fusing brazing material containing 10-70% by weight of silver, 10-75% by weight of antimony, 10-50% by weight of indium and/or tin and 0-15% by weight of copper, and wiring boards and semiconductor device-housing packages assembled with the foregoing brazing material.
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