Transfer of flux onto electrodes and production of bumps on electrodes
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United States of America Patent
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May 4, 1999
Issued Date -
N/A
app pub date -
Jul 9, 1996
filing date -
Jul 11, 1995
priority date (Note) -
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Abstract
A process of transferring a flux on electrodes of a semiconductor chip, a film carrier, or a substrate, the process comprising: using a transfer apparatus including a transfer baseplate having protrusions corresponding to said electrodes; dipping the tips of the protrusions of the transfer baseplate in a flux bath to cause the flux to stick to the tips; then aligning the protrusions of the transfer baseplate with the electrodes; and transferring the stuck flux onto the electrodes from the tips.
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