Method of packaging electronic components
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United States of America Patent
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Apr 27, 1999
Grant Date -
N/A
app pub date -
Apr 29, 1997
filing date -
May 8, 1996
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention provides a method of packaging an electronic component, which permits improvement of mounting accuracy of various components against non-uniform deformation of the printed circuit board, and simplification of the correcting operation. The method of the present invention comprises the steps of dividing the printed circuit board c to be placed on the packaging section m into a plurality of prescribed areas c1 . . . , determining a reference origin a1 . . . for mounting the electronic component for each of the plurality of areas, setting the resultant coordinates in the control means 1, measuring a reference origin for each of the plurality of areas by means of detecting means prior to packaging, calculating and setting a correction origin for each area through the control means 1 on the basis of this measurement, controlling the mounting head 2 individually for each area, and mounting the prescribed electronic component.
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