Abrasive composition

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United States of America Patent

PATENT NO 5895509
SERIAL NO

08980649

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Abstract

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An abrasive composition which can realize chemical-mechanical polishing superior in polishing speed and polishing uniformity. The abrasive composition comprises abrasive grains, isopropyl alcohol, and water. Grain sizes of the abrasive grains are preferably 30 to 250 nm, and the abrasive grains are preferably SiO.sub.2. Further, it is preferable that contents of the abrasive grains and isopropyl alcohol are 5 to 30 wt % and 1 to 15 wt %, respectively. The abrasive composition of the present invention is characterized in that it is deaerated.

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Patent Owner(s)

Patent OwnerAddress
KABUSHIKI KAISHA ULTRACLEAN TECHNOLOGY RESEARCH INSTITUTE1-4 HONGO 4-CHOME BUNKYO-KU TOKYO 113

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nitta, Takahisa Tokyo, JP 46 742
Ohmi, Tadahiro 1-17-301, Komegabukuro 2-chome, Aoba-ku, Sendai-shi, Miyagi-ken 980, JP 798 14083

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