Method of operating a molding machine with release film

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United States of America Patent

PATENT NO 5891384
SERIAL NO

08561021

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An object of the present invention is to provide a resin molding machine having molding dies, which have simple structures and which can be easily made. Another object is to provide a method of resin molding using release film, which is capable of employing various materials as a material for the molding dies. In the resin molding machine of the present invention, molding dies have molding sections including cavities, and the molding dies are capable of clamping a member to be molded. A pot pressurizes and sends resin melt to the cavities. A fixing mechanism fixes release film, which is capable of easily peeling off from the molding dies and resin for molding, on inner faces of the molding sections and clamping faces, and the fixing mechanism fixes the release film by sucking air.

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Patent Owner(s)

Patent OwnerAddress
APIC YAMADA CORPORATION90 OOAZA KAMITOKUMA CHIKUMA-SHI NAGANO 3890898 ?3890898

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Miyajima, Fumio Nagano, JP 21 494

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