Method and apparatus for cutting diamond
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United States of America Patent
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Apr 6, 1999
Grant Date -
N/A
app pub date -
Apr 1, 1996
filing date -
Apr 1, 1996
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A wire is used to cut or slice diamond by passing the wire rapidly and under light load over and into the diamond surface along a line to be cut. In one form of the invention, the wire comprises a metal that dissolves diamond, such as iron or nickel and the wire and/or diamond is preferably heated to approach the metal-carbon eutectic temperature and create sensible reaction rates of the carbon on the wire surface. In another form of the invention, the moving wire carries a molten oxidant to enhance the cutting rate. The molten oxidant may be, for example, sodium nitrate, which oxidizes carbon.
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