Copper-tungsten alloys and their manufacturing methods
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United States of America Patent
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Mar 30, 1999
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N/A
app pub date -
Dec 23, 1996
filing date -
Jan 20, 1995
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Abstract
Copper-tungsten alloys used for materials of electrode, electric contacts, package materials for semiconductors, heat sink and their manufacturing methods. The copper-tungsten alloy contains preferably 5 to 30 wt. % of copper, 0.002 to 0.04 wt. % of phosphor, the remaining portion being substantially all tungsten, and it is preferable to contain in these alloys 0.1 to 0.5% of cobalt, nickel or iron or else any combined two out of these three.
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