Bottom lead semiconductor package having folded leads
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United States of America Patent
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Mar 23, 1999
Grant Date -
N/A
app pub date -
Jun 17, 1997
filing date -
Jun 18, 1996
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A bottom lead semiconductor package includes a plurality of outer leads, wherein an outer portion of each of the outer leads is downwardly bent, and inner leads extend from a corresponding one of the outer leads respectively and are bent at least once upwardly and folded over onto a corresponding upper surface of the outer leads. A semiconductor chip is attached to an upper surface of each of the inner leads by a nonconductive adhesive, and a plurality of conductive wires or bumps electrically couples the chip to the inner leads. A molding compound seals a portion of the package including the chip, the inner leads and the wires, but externally exposes a downwardly bent portion of each of the outer leads.
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