Substrate and heat sink for a semiconductor and method of manufacturing the same
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United States of America Patent
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Mar 23, 1999
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N/A
app pub date -
Feb 14, 1996
filing date -
Feb 17, 1995
priority date (Note) -
Expired
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Abstract
A substrate serving as a heat sink for a semiconductor efficiently radiates heat from a semiconductor element mounted thereon. The substrate consists of a composite alloy metal which consists of a sintered body of a metal powder having a high melting point such as W and Mo impregnated with a filling metal such as Cu and Ag, wherein the sintered body of a metal powder having a high melting point has a grain size composition of a combination of a plurality of powder groups having statistically different average grain sizes from group to group, and the powder of each group is dispersed uniformly.
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