Ultrasonic vibration soldering apparatus and resonator used therein
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United States of America Patent
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Mar 23, 1999
Grant Date -
N/A
app pub date -
Apr 17, 1997
filing date -
Jun 28, 1996
priority date (Note) -
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Abstract
A support portion for attaching a horn main body to a solder tank is provided on the horn main body at a nodal point f2 and ultrasonic vibration from an external transducer is transmitted to solder in the solder tank through the horn main body.
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