Ball grid array packaging method for an integrated circuit and structure realized by the method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 16, 1999
Grant Date -
N/A
app pub date -
Jun 9, 1997
filing date -
Jun 9, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A BGA packaging method for an IC includes steps of providing a first dry film to a copper plate, plating nickel-copper to form circuits on one side of the copper plate, providing a second dry film, selectively plating nickel-gold, removing the dry films, providing an insulating layer, providing a back plate, attaching a chip, wire bonding, encapsulating the chip and wires with plastic, etching copper, providing solder resist and attaching solder balls. By this method, a packaged IC with excellent electrical characteristics and heat dissipation can be obtained through a simple procedure.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully