Method for mounting surface mount devices to a circuit board
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Mar 16, 1999
Issued Date -
N/A
app pub date -
Apr 24, 1997
filing date -
May 17, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Disclosed is method for aligning and mounting electrical components, such as packaged integrated circuits, to a printed circuit board. During an alignment phase, a sample component is attached to a stand-in circuit board at a component site. A base plate, having alignment elements, is then fitted to the board proximate the attached sample component. Next, a chuck is mounted to the sample component, and an alignment plate positioned to engage the alignment elements of the base plate, and affixed to the chuck, forming a chuck assembly that is aligned to the base plate and registered to the component site of the circuit board. During a production phase, the base plate is placed on a printed circuit board at a location substantially identical to that on the stand-in printed circuit board. A chuck assembly, configured substantially identical to that formed during the alignment phase, and carrying a component to be mounted, is attached to the base plate so that the alignment plate engages the alignment elements. The chuck, carrying the electrical component is registered to the base plate through the alignment plate to accurately locate the component leads over the circuit pads on the circuit board.
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