Electromagnetic interference shielding enclosure and heat sink with compression coupling mechanism
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United States of America Patent
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-
Mar 9, 1999
Grant Date -
N/A
app pub date -
Jun 18, 1997
filing date -
Jun 18, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A EMI shield which includes a heat sink and a compression coupling. A top housing formed of electrically conductive material is placed over a circuit board containing electronic devices and is electrically coupled to an electrical ground through contact along the length of a conductive strip which is connected to an electrical ground. A bottom housing formed of electrically conductive material is connected to an electrical ground through electrical contact along the length of a conductive strip located on the bottom of the circuit board so as to form a EMI shielding enclosure. The top housing is formed of thermally conductive material and includes extended surfaces for conducting heat away from the electronic devices contained below the top housing. In addition, the bottom housing is formed of thermally conductive material so as to form a thermally conductive enclosure which acts as a heat sink, effectively cooling the electronic devices contained therewithin. A compression coupling mechanism which uses springs to press the top housing towards the bottom housing gives consistent electrical contact between a microprocessor and a circuit board.
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