Geometries and configurations for magnetron sputtering apparatus
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United States of America Patent
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Mar 9, 1999
Issued Date -
N/A
app pub date -
Aug 16, 1996
filing date -
Feb 8, 1988
priority date (Note) -
Expired
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Abstract
A thin film coating system incorporates separate, separately-controlled deposition and reaction zones for depositing materials such as refractory metals and forming oxides and other compounds and alloys of such materials. The associated process involves rotating or translating workpieces past the differentially pumped, atmospherically separated, sequentially or simultaneously operated deposition and reaction zones and is characterized by the ability to form a wide range of materials, by high throughput, and by controlled coating thickness, including both constant and selectively varied thickness profiles.
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