Heat-dissipating substrate for micro-electronic devices and fabrication method
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United States of America Patent
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Mar 2, 1999
Issued Date -
N/A
app pub date -
Oct 10, 1997
filing date -
Apr 14, 1993
priority date (Note) -
Expired
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Abstract
Heatsinks for microcircuit packages are formed by first mold-pressing a composite powder of free-flowing spray-dried particles of copper and at least one other denser material such as tungsten and/or molybdenum breakably agglutinated in nodules grouping sub-nodules of surface alloyed pairs of particles of each metal, the proportions of which are adjusted to match the thermal expansion characteristics of the microcircuit material. The pressed compacts are then heated in a sintering furnace at 1090.degree. C. to 1150.degree. C. in order to effect an homogeneous distribution of the melting copper throughout the structure. The process results in a readily usable component having good thermal conductivity and matched thermal expansion that requires no further machining.
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