Direct metal bonding
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United States of America Patent
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-
Mar 2, 1999
Issued Date -
N/A
app pub date -
Dec 15, 1995
filing date -
Nov 10, 1994
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method for use with a direct metal bonding type process in which a metal layer is bonded to an insulating layer. The metal layer is applied to the insulating layer to enable a direct metal bond to be formed between the layers. The integrity of the bond between a portion of the layers is reduced by providing, prior to bonding, an interrupter between the portion of the layers. A structure in which a metal layer is directly metal bonded to an insulating layer and includes an interrupter between a portion of the metal layer and a portion of the insulating layer. The interrupter reduces the integrity of the bond between the portion of the metal layer and the portion of the insulating layer. The structure includes other features similar to those set forth with respect to the above described method.
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