Lead frame having a supporting pad with a plurality of slits arranged to permit the flow of resin so as to prevent the occurrence of voids
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United States of America Patent
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Feb 23, 1999
Issued Date -
N/A
app pub date -
Apr 30, 1997
filing date -
Sep 1, 1994
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The resin-sealed package includes a lead frame having a supporting and heat spreading pad and inner and outer leads arranged to surround the supporting and head spreading pad. A tape automated bonding (TAB) structure is provided having a semiconductor chip having bonding pads formed on a periphery of a main surface of the semiconductor chip. A rear surface of the semiconductor chip is fixed to the supporting and head spreading pad. TAB leads are provided on the main surface of the semiconductor chip. One end of each TAB lead is connected with said bonding pads and the other end of each TAB lead is connected with one end of each inner lead of the lead frame. A resin molding is used for sealing the TAB structure and the supporting and head spreading pad and inner leads of the lead frame. An area of the supporting and head spreading pad is larger than that of the semiconductor chip of said TAB structure. The supporting and heat spreading pad includes a first slit positioned under the semiconductor chip and a second slit positioned outside of the semiconductor chip in a plane view.
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