Pressure sensor package and method of making the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Feb 23, 1999
Grant Date -
N/A
app pub date -
Apr 4, 1996
filing date -
Apr 4, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A pressure sensor package and method for producing the same. The package includes a pressure sensor base, a pressure sensor diaphragm positioned over the pressure sensor base, and a pressure sensor cap positioned over the pressure sensor diaphragm and secured relative to the pressure sensor base such that a portion of the pressure sensor diaphragm is deformed between the pressure sensor cap and the pressure sensor base. The deformation can occur along a line of deformation, preferably to form a closed path adjacent a periphery of the pressure sensor diaphragm. In one embodiment, the pressure sensor diaphragm is deformed between an inner surface of the pressure sensor cap and an outer surface of the pressure sensor base along the line of deformation, and the inner surface and the outer surface diverge from each other when moving away from the line of deformation. For example, the pressure sensor diaphragm can be deformed between a concave inner radius and a convex outer radius, wherein the inner radius is larger than the outer radius.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully