Method of treating a semi-conductor wafer
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United States of America Patent
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Feb 23, 1999
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N/A
app pub date -
Dec 28, 1994
filing date -
Jul 4, 1992
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Abstract
A wafer processing method relates to treating a semi-conductor wafer and in particular, but not exclusively, to planarization. The method consists of depositing a liquid short-chain polymer formed from a silicon containing gas or vapor. Subsequently water and OH are removed and the layer is stabilised.
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