Method of making a casing for receiving electronic components or switching circuits
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United States of America Patent
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Feb 23, 1999
Grant Date -
N/A
app pub date -
Apr 17, 1996
filing date -
Apr 18, 1995
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A process of making a casing having at least one open end and formed with electric conducting passages and connections for electronic components or switching circuits, includes the following steps: preparing a formed body, made of ceramics, glass, glass-ceramics, metal or silicon carbide, with passageways in form of bores and/or indentations, placing the formed body in a mold and pouring liquid metal in the mold to surround the formed body, thereby filling the first passageways, and removing metal from the formed body to leave metal only in the first passageways.
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