Apparatus and method for rapid thermal processing
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Feb 16, 1999
Issued Date -
N/A
app pub date -
Jan 8, 1997
filing date -
Apr 12, 1996
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A closable enclosure for rapid thermal processing of semiconductor wafers is presented, wherein the closable enclosure has an enclosed volume less than 10 times the volume of the wafer, and wherein the closable enclosure may be closed about the wafer while the closable enclosure is surrounded by the process gas.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully