Apparatus and method for machining conductive structures on substrates
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United States of America Patent
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Feb 16, 1999
Grant Date -
N/A
app pub date -
Feb 26, 1993
filing date -
Feb 26, 1993
priority date (Note) -
Expired
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Abstract
The present invention is an apparatus and method for machining a laminate structure to form a selected shape. The method includes forming a first layer on a substrate. A first protective structure is defined that is attached to each of the first layer and the substrate. At least a portion of the protective structure has the selected shape. The laminate structure is then machined along the first protective structure thereby forming at least a portion of the selected shape.
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