Semiconductor device with lead structure on principal surface of chip
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United States of America Patent
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Feb 9, 1999
Issued Date -
N/A
app pub date -
Sep 26, 1996
filing date -
Jun 11, 1990
priority date (Note) -
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Abstract
A semiconductor device having inner leads secured via insulating adhesive films to the principal surface of a semiconductor chip and electrically connected to the respective external terminals of the semiconductor chip. The semiconductor device that can be about the size of the chip is so configured that an outer lead is continuously extended from each inner lead up to the rear surface opposite to the principal surface of the semiconductor chip in order to hold the leads and an external device in conduction.
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