Method of manufacturing a group II-VI compound semiconductor

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United States of America Patent

PATENT NO 5868834
SERIAL NO

08876228

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Abstract

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The disclosure describes a method of manufacturing a Group II-VI compound semiconductor thin film by a vapor-phase epitaxy using an organic metal compound of Group II element and a hydride or an organic metal compound of Group VI element as the raw material, which comprises repeating alternate introduction of an organic metal compound of Group II element and a halide gas, a halogen gas or a mixture thereof; or adding a halide gas, a halogen gas or a mixture thereof to a gas for vapor-phase epitaxy.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI KASEI CORPORATIONTOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fujimori, Toshinari Inashiki, JP 11 110
Goto, Hideki Tsuchiura, JP 90 655
Shimoyama, Kenji Tsuchiura, JP 40 381

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