Electroless plating bath of iridium
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United States of America Patent
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Feb 2, 1999
Issued Date -
N/A
app pub date -
May 6, 1997
filing date -
Dec 1, 1994
priority date (Note) -
Expired
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Abstract
The present invention relates to a plating bath of the hydrazine type for electroless plating on the surface of a plated substance with iridium. The first plating bath is an electroless plating bath of iridium which contains a hydrazine complex of iridium and has pH of 1-7. The second plating bath is an electroless plating bath of iridium which contains hydrazine hydrate and/or hydrazinium salt, and iridium halide and/or halogenoiridate in the molar ratio of 1-1.0 and has pH of lower than 3. The plating bath of this invention is used, for example, for producing of a junction of a cation exchange membrane and iridium, which is used for a water electrolytic cell of the macromolecule solid electrolyte type.
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