Photolithographic pattern generation

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United States of America Patent

PATENT NO 5863705
SERIAL NO

08793546

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Abstract

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The invention concerns a photolithographic method of producing sub-micron structural features by applying to a substrate a photosensitive resist layer consisting of a polymer containing tert-butyl ester or tert-butoxycarbonyloxy groups, a photosensitive component (in the form of an ester of naphthoquinonediazide-4-sulfonic acid and an aromatic hydroxy compound) and a suitable solvent. The photoresist is then dried, exposed in an imaging manner, subjected to a temperature treatment in the range between 120.degree. and 150.degree. C. for a period of 100 to 600 seconds, and wet-developed (single-layer resist system). The invention also concerns a method in which a corresponding two-layer resist system is used.

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Patent Owner(s)

Patent OwnerAddress
POLARIS INNOVATIONS LIMITEDDUBLIN 2

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Leuschner, Rainer Erlangen, DE 85 1476
Schmidt, Erwin Erlangen, DE 59 864
Sezi, Recai Rottenbach, DE 97 944

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