Method of treating a semi-conductor wafer
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United States of America Patent
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Jan 12, 1999
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app pub date -
Jan 5, 1996
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May 14, 1994
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Abstract
In a method of treating a semi-conductor wafer a short-chain polymer is deposited on the wafer to planarise surface features on the wafer and a diffusion layer is deposited on the surface of the polymer layer to allow moisture to be released from the polymer at a controlled rate.
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