Negative working photoresist composition based on polyimide primers
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United States of America Patent
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Jan 5, 1999
Grant Date -
N/A
app pub date -
Feb 14, 1997
filing date -
Mar 27, 1996
priority date (Note) -
Expired
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Abstract
Negative working photoresist compositions containing: a) a polyimide primer containing recurring structural units of formula (I) in the specification as well as b) a photoinitiator for polymerizing olefin double bonds, which are characterized by in that they contain at least one other component c), which is selected from the group consisting of c1) organosilicon compounds with one or more hydroxyl groups, c2) compounds of formula (IIa) in the specification, c3) compounds of formula (IIb) as in the specification, c4) mixtures comprised of two or more components selected from components of c1), c2) and c3), have the advantage that they can be developed with a developer, which comprises up to 50 to 100 wt. % of an aqueous-alkaline medium, whereby the balance to 100 wt. % is formed by one or more organic solvents.
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