Long fin omni-directional heat sink
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United States of America Patent
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Dec 29, 1998
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N/A
app pub date -
Feb 20, 1996
filing date -
Feb 20, 1996
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A heat sink adapted to dissipate heat from an electronic component wherein a plurality of heat dissipating perforated fins project generally outwardly from a planar base and are spaced apart by channels therebetween. The height of the perforated fins to the width of the channels is at least about 8 to 1. The perforations through the fins are such that the flow of cooling fluid through the fins generally emulates the flow through a comparable pin grid array heat sink. The fin structure is such that the fin is structurally supported against deformation, particularly during cross-cutting operations.
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