Low friction, ductile, multilayer electrodeposits
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United States of America Patent
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Dec 29, 1998
Issued Date -
N/A
app pub date -
Apr 4, 1997
filing date -
Apr 4, 1996
priority date (Note) -
Expired
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Abstract
The present invention relates to composite articles including a surface layer of tin, lead, silver or an alloy thereof that contains co-deposited non-ionic polymeric particles to provide a reduced-friction deposit that has an initially low coefficient of friction and low insertion force and fretting corrosion in separable electronic connectors, and to methods for preparing the plated articles. The polymeric particles have a size between about 0.1 to 0.45 .mu.m in diameter to reduce the coefficient of friction of the resultant deposit to about 0.45 or below. Also, the deposit has excellent electrical properties and can be successfully soldered. The invention also relates to a solution for plating the surface layer of the composite articles, which surface layer reduces insertion force and fretting corrosion of separable electronic connectors.
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