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United States of America Patent
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Dec 29, 1998
Grant Date -
N/A
app pub date -
Nov 29, 1996
filing date -
Dec 1, 1995
priority date (Note) -
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status (Latency Note)
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Abstract
For the purpose of high frequency effective insulation for gaps in the enclosure of electronic devices, a plate 1 is proposed that shows a groove 9 on at least one of its narrow sides 7, 8. In this groove 9 is a spring element 2 with its attached leaf clip 12. Attached on the leaf clip 12 is a right-angled leaf spring 13, with a base piece 21 and a contact piece 22. The contact piece 22 is bent back on itself and bears a contact fin 29, which makes contact with the corresponding contact piece of a neighboring prefabricated component.
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