Resin-molded product and method of manufacturing the same
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United States of America Patent
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Dec 22, 1998
Grant Date -
N/A
app pub date -
May 16, 1996
filing date -
May 16, 1995
priority date (Note) -
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status (Latency Note)
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Abstract
Packing is fixed to and adheres to a molded damper on the outer periphery of the both sides of the damper body like a frame. To prevent defective molded products, a portion of the damper body having the packing disposed thereon is made thicker than a portion without the packing so that resin can flow into the portion where the packing is disposed before it goes into the portion without the packing.
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