Multilayer electronic structure and its preparation
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United States of America Patent
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Dec 15, 1998
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N/A
app pub date -
Sep 13, 1995
filing date -
Sep 13, 1995
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Abstract
An electronic structure is formed of alternating layers of a metal and a cured ceramic-polymer mixture. The ceramic-polymer mixture is prepared by mixing small ceramic particles into a flowable, curable polymer. The mixture is spread over a first metallic layer and, optionally, B-stage cured. Additional metallic layers and ceramic-polymer layers are added in alternating fashion. Metallic interconnects may be provided through overlying ceramic-polymer layers to a particular metallic layer. The resulting structure is heated to a moderate temperature to cure the polymer.
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