Production method for encapsulating a semiconductor device
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United States of America Patent
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Dec 8, 1998
Grant Date -
N/A
app pub date -
Dec 7, 1995
filing date -
Dec 8, 1994
priority date (Note) -
Expired
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Abstract
A method of producing a semiconductor device by encapsulating a semiconductor element with a resin, which comprises disposing a semiconductor element with lead frames and an encapsulating resin in a state of being sandwiched between a pair of films on a molding mold having a port for setting the encapsulating resin, closing the mold, pressing the encapsulating resin between the films in a heated state by a plunger vertically moving in the pot, and injecting the molten encapsulating resin in the inside of the mold cavity from the pot portion through a runner portion to encapsulate the semiconductor element with the encapsulating resin.
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