Die pad structure for solder bonding
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United States of America Patent
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-
Dec 1, 1998
Grant Date -
N/A
app pub date -
Jan 24, 1996
filing date -
Sep 28, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A lead frame having a die pad of such a shape that prevents scattering of solder to lead when a chip is mounted on the lead frame, and a semiconductor device using such a lead frame are provided. The lead frame includes a die pad having a region surrounded by a first side, a second side opposing to the first side, a third side different from the first and second sides, and a fourth side opposing to the third side, and a lead formed of a conductor and electrically connected to a semiconductor element. The die pad includes a notch extending along the first and the second sides and positioned opposing to a main surface of the semiconductor element, and a through hole extending along the third and fourth sides and positioned opposing to the main surface of the semiconductor element. The semiconductor device employs the die pad.
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