Process and apparatus for coating printed circuit boards
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United States of America Patent
Stats
-
Dec 1, 1998
Grant Date -
N/A
app pub date -
Feb 27, 1996
filing date -
May 12, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A process for coating printed circuit boards is described, comprising the following process steps: the printed circuit boards on the coating side are kept at room temperature and, as appropriate, are heated to approximately 120.degree. C.; then in a first step, a preferably photopolymerisable, meltable, low-molecular-weight coating composition that preferably has an average molecular weight of from 500 to 1500 and that is highly viscous to solid at room temperature is coated in a thickness of approximately from 10 .mu.m to 200 .mu.m on to the surface(s) of the printed circuit board to be coated; in a second step, a second, high-molecular-weight, photopolymerisable coating composition preferably having an average molecular weight of from 2000 to 10000 is applied in a thickness of from 2 .mu.m to 20 .mu.m over the first layer; and the printed circuit boards so coated are cooled to room temperature and the two-layer photopolymerisable coating is exposed, preferably in contact with a mask, is developed and is cured fully. An apparatus for carrying out the process outlined above is also described.
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