Slurry dispensing system for chemical-mechanical polishing apparatus
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United States of America Patent
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Dec 1, 1998
Grant Date -
N/A
app pub date -
Apr 18, 1997
filing date -
Apr 18, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Chemical-mechanical polishing apparatus includes three subassemblies, a top subassembly which is non-rotating but which has a lower section which forms a shell about a center and a lower subassembly both of which rotate within the shell. The system also includes a slurry dispensing system which is embedded in the shell and which is operative to supply slurry just in front of the advancing edge of a wafer being polished by the system. The slurry dispensing system includes a tube with holes arranged 180 degrees about the shell of the non-rotating subassembly which is also operative to retain the wafer in contact with the (rotating) pad covered platen with which it is in contact.
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